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What is encapsulation? Why is encapsulation useful

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packaging is the process of assembling an integrated circuit into the final product of a chip. In short, put the die produced by foundry on a substrate that plays a bearing role, lead out the pins, and then fix the packaging as a whole

because the chip must be isolated from the outside world to prevent the corrosion of the chip circuit by impurities in the air, resulting in the decline of electrical performance. On the other hand, the encapsulated chip is also easier to install and transport. Because the quality of packaging technology also directly affects the performance of the chip itself and the design and manufacture of PCB (printed circuit board) connected with it, it is very important

extended data

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1. Chip packaging material

plastic, ceramic, glass, metal, etc.

2. Packaging form

ordinary dual in-line, ordinary single in-line, small dual in-line flat, small four in-line flat, round metal, bulky thick film circuit, etc

3. The largest package volume

is thick film circuit, followed by double in-line plug-in, single in-line plug-in, and the smallest is metal package, double in-line flat and four in-line flat

reference source: Baidu Encyclopedia – Packaging & nbsp

packaging is the process of assembling integrated circuits into the final products of chips. In short, it is to place the die produced by foundry on a substrate that plays a bearing role, lead out the pins, and then fix the packaging as a whole

packaging refers to connecting the circuit pins on the silicon wafer to the external connector with wires to facilitate the connection of other devices. Package form refers to the shell used to install semiconductor integrated circuit chips

it not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also connects the pins of the package shell with wires through the contacts on the chip, and these pins are connected with other devices through the wires on the printed circuit board, so as to realize the connection between the internal chip and the external circuit

because the chip must be isolated from the outside world to prevent the corrosion of the chip circuit by impurities in the air, resulting in the decline of electrical performance. On the other hand, the encapsulated chip is also easier to install and transport. Because the quality of packaging technology also directly affects the performance of the chip itself and the design and manufacture of PCB (printed circuit board) connected with it, it is very important

extended data:

I. packaging process

because silicon wafers drawn from wafers come out of the factory. If they are not packaged, it is not convenient for transportation, storage, welding and use, and they will be affected by impurities, moisture and rays in the air, resulting in damage, resulting in circuit failure or performance degradation

taking “dual in-line package (DIP) as an example, the following figure briefly illustrates the packaging process. After passing the test, the die drawn on the wafer shall be placed tightly on the substrate for supporting and fixing (there is also a layer of material with good heat dissipation on the substrate)

connect the metal contact point (pad, pad) on die with the external pin by welding with multiple metal wires, then embed resin and seal it with plastic shell to form the whole chip

II. Development process

structure: to – & gt; DIP-> PLCC-> QFP-> BGA-> CSP

materials: metals, ceramics – & gt; Ceramics, plastics – & gt; Plastic

pin shape: long lead in-line – & gt; Short lead or leadless mounting – & gt; Spherical bump

assembly method: through hole insertion – & gt; Surface assembly – & gt; Direct installation

reference source: Baidu Encyclopedia – packaging

packaging, as the name suggests, is sealed and packaged
packaging is widely used in various industries and fields. You are probably asking about packaging in the IT industry, which is divided into two categories: software packaging and hardware packaging
I Hardware packaging:
the manufacturing process of digital hardware is becoming more and more precise, and the more precise it is, the easier it is to be disturbed by the outside world. In order to eliminate interference, packaging has become a necessary process. For example, the current computer central processing unit (CPU), random access memory (RAM memory module) and so on will be packaged. The packaging process is generally to add a metal shell. It can improve the heat dissipation capacity, enhance the ability to shield electromagnetic interference, shield dust and so on
II Software encapsulation:
software encapsulation is divided into two types, one is the underlying encapsulation, and the other is the encapsulation before release
1. Bottom encapsulation: the software is written in programming language. There is a very important component in the language called “function”. Generally, the function is closed, and several data interfaces are reserved to hide the internal situation of the function. This is called encapsulation. This kind of encapsulation is the bottom encapsulation, which has no impact on users, but for programmers, using encapsulated functions will greatly improve the efficiency of programming
2. Pre release encapsulation. When installing software, we often encounter this situation: after double clicking an installation file, a large number of files will appear in the installation path. For example, QQ downloads an installation file. After installation, thousands of files will appear in the QQ directory. Where did such a pile of documents come from? This is why Tencent packaged all the files needed to run QQ before QQ was released, and became an installation package. Encapsulation before release is convenient for download and dissemination. Most programs will be encapsulated before release
3. The operating system can also be encapsulated (repackaged). However, it is slightly different from the second packaging. When the system is encapsulated (resealed), the information about users will be cleared, the information about the system will be reset, the relevant files will be packaged, and so on. The encapsulated system is a brand new system

knock by hand, personal experience, seek the red flag.

packaging a bare chip is packaging. Packaging can turn every die in a wafer into a chip. Encapsulation is very important!

simple. On Taobao, enter “system development – system packaging – system customization OEM” to have a simple and easy to understand graphic explanation, because people do business. If they can’t explain clearly, there will be no customers.

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